42-6572 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 42POS TIN
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish - Post | Termination | Mounting Type | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Type | Type | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | Tin | Solder | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | 42 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | Tin | Solder | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | 42 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | Tin | Solder | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | 5.08 µm | 200 µin | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Beryllium Copper | 200 µin | 5.08 µm | 42 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper |