42-6573 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 42POS TIN
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Features | Mounting Type | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Pitch - Post | Termination | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Tin | 200 µin | 5.08 µm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | 42 | Closed Frame | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Beryllium Copper | 0.1 in | 2.54 mm | Solder | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Tin | 200 µin | 5.08 µm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | 42 | Closed Frame | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Beryllium Copper | 0.1 in | 2.54 mm | Solder | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Tin | 200 µin | 5.08 µm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 0.1 " | 2.54 mm | 42 | Closed Frame | Through Hole | Beryllium Copper | 5.08 µm | 200 µin | Beryllium Copper | 0.1 in | 2.54 mm | Solder | Polyphenylene Sulfide (PPS) Glass Filled |