AT28C010E Series
Manufacturer: Microchip Technology
Beta
⌘K
IC EEPROM 1MBIT PARALLEL 32PLCC
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Supplier Device Package | Supplier Device Package [y] | Supplier Device Package [x] | Technology | Memory Type | Package / Case | Memory Organization | Memory Size | Write Cycle Time - Word, Page | Access Time | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Interface | Memory Format | Mounting Type | Package / Case | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | -40 °C | 85 °C | 32-PLCC | 11.43 | 13.97 | EEPROM | Non-Volatile | 32-LCC (J-Lead) | 128K x 8 | 1 Mbit | 10 ms | 150 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | |||
Microchip Technology | -40 °C | 85 °C | 32-PLCC | 11.43 | 13.97 | EEPROM | Non-Volatile | 32-LCC (J-Lead) | 128K x 8 | 1 Mbit | 10 ms | 150 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | |||
 Microchip Technology | -40 °C | 85 °C | 32-SOP | EEPROM | Non-Volatile | 32-SOIC | 128K x 8 | 1 Mbit | 10 ms | 250 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | 0.295 in | 7.5 mm | |||
 Microchip Technology | -40 °C | 85 °C | 32-TSOP | EEPROM | Non-Volatile | 32-TFSOP | 128K x 8 | 1 Mbit | 10 ms | 120 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | 18.4 mm | 0.724 in | |||
 Microchip Technology | -40 °C | 85 °C | 32-TSOP | EEPROM | Non-Volatile | 32-TFSOP | 128K x 8 | 1 Mbit | 10 ms | 120 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | 18.4 mm | 0.724 in | |||
Microchip Technology | 32-PLCC | 11.43 | 13.97 | EEPROM | Non-Volatile | 32-LCC (J-Lead) | 128K x 8 | 1 Mbit | 10 ms | 120 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | |||||
 Microchip Technology | -40 °C | 85 °C | 32-PLCC | 11.43 | 13.97 | EEPROM | Non-Volatile | 32-LCC (J-Lead) | 128K x 8 | 1 Mbit | 10 ms | 150 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | |||
 Microchip Technology | -55 °C | 125 °C | 32-FlatPack Ceramic Bottom-Brazed | EEPROM | Non-Volatile | 32-CFlatpack | 128K x 8 | 1 Mbit | 10 ms | 150 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | |||||
Microchip Technology | -40 °C | 85 °C | 32-TSOP | EEPROM | Non-Volatile | 32-TFSOP | 128K x 8 | 1 Mbit | 10 ms | 150 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Surface Mount | 18.4 mm | 0.724 in | |||
 Microchip Technology | 32-PDIP | EEPROM | Non-Volatile | 32-DIP | 128K x 8 | 1 Mbit | 10 ms | 150 ns | 4.5 V | 5.5 V | Parallel | EEPROM | Through Hole | 15.24 mm | 0.6 in |