36-6513 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET 36POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Housing Material | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Material - Mating | Type [custom] | Type [custom] | Type | Features | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Post [custom] | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | 36 | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Closed Frame | 0.1 " | 2.54 mm | Tin | 0.25 µm | 10 µin | Through Hole | Brass | Solder | 200 µin | 5.08 µm |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | 36 | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Closed Frame | 0.1 " | 2.54 mm | Gold | 0.25 µm | 10 µin | Through Hole | Brass | Solder | 10 Áin | 0.25 çm |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | 36 | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Closed Frame | 0.1 " | 2.54 mm | Tin | 0.25 µm | 10 µin | Through Hole | Brass | Solder | 200 µin | 5.08 µm |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Polyamide (PA46) Nylon 4/6 Glass Filled | 0.1 in | 2.54 mm | -55 C | 105 ░C | 36 | Gold | Beryllium Copper | 15.24 mm | 0.6 in | DIP | Closed Frame | 0.1 " | 2.54 mm | Tin | 0.25 µm | 10 µin | Through Hole | Brass | Solder | 200 µin | 5.08 µm |