24-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Material - Mating	Termination	Type	Type	Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Features	Contact Material - Post	Pitch - Post	Pitch - Post
Aries Electronics 24-3575-18	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Copper	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	Tin	0.1 "	2.54 mm	200 µin	5.08 µm	Through Hole	12	2	24	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Beryllium Copper	0.1 in	2.54 mm
Aries Electronics 24-3575-11	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Copper	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	Tin	0.1 "	2.54 mm	200 µin	5.08 µm	Through Hole	12	2	24	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Beryllium Copper	0.1 in	2.54 mm
Aries Electronics 24-3575-16	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Copper	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	Tin	0.1 "	2.54 mm	200 µin	5.08 µm	Through Hole	12	2	24	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Beryllium Copper	0.1 in	2.54 mm
Aries Electronics 24-3575-10	0.11 in	2.78 mm	1 A	UL94 V-0	Beryllium Copper	Solder	DIP ZIF (ZIP)	7.62 mm	0.3 in	Tin	0.1 "	2.54 mm	200 µin	5.08 µm	Through Hole	12	2	24	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	Beryllium Copper	0.1 in	2.54 mm