24-1508 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Type	Type	Termination	Mounting Type	Features	Housing Material	Contact Material - Post [custom]	Contact Finish - Post	Contact Material - Mating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 24-1508-21	9.14 mm	0.36 in	3 A	UL94 V-0	12	2	24	0.25 µm	10 µin	10 Áin	0.25 çm	Gold	DIP	5.08 mm	Wire Wrap	Through Hole	Closed Frame	Polyamide (PA46) Nylon 4/6	Brass	Gold	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	125 °C
Aries Electronics 24-1508-30	12.7 mm	0.5 in	3 A	UL94 V-0	12	2	24	0.25 µm	10 µin	200 µin	5.08 µm	Gold	DIP	5.08 mm	Wire Wrap	Through Hole	Closed Frame	Polyamide (PA46) Nylon 4/6	Brass	Tin	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	105 ░C
Aries Electronics 24-1508-31	12.7 mm	0.5 in	3 A	UL94 V-0	12	2	24	0.25 µm	10 µin	10 Áin	0.25 çm	Gold	DIP	5.08 mm	Wire Wrap	Through Hole	Closed Frame	Polyamide (PA46) Nylon 4/6	Brass	Gold	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	125 °C
Aries Electronics 24-1508-20	9.14 mm	0.36 in	3 A	UL94 V-0	12	2	24	0.25 µm	10 µin	200 µin	5.08 µm	Gold	DIP	5.08 mm	Wire Wrap	Through Hole	Closed Frame	Polyamide (PA46) Nylon 4/6	Brass	Tin	Beryllium Copper	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	105 ░C