22-4518 Series

Catalog

CONN IC DIP SOCKET 22POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Features	Contact Finish - Post	Termination	Mounting Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Contact Material - Post [custom]	Housing Material	Type	Type	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 22-4518-11H	3 A	0.125 in	3.18 mm	UL94 V-0	0.1 in	2.54 mm	0.1 "	2.54 mm	Open Frame	Gold	Solder	Through Hole	Gold	10 Áin	0.25 çm	11	22	2	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.4 in	DIP	Beryllium Copper	0.25 µm	10 µin
Aries Electronics 22-4518-10	3 A	0.125 in	3.18 mm	UL94 V-0	0.1 in	2.54 mm	0.1 "	2.54 mm	Open Frame	Tin	Solder	Through Hole	Gold	200 µin	5.08 µm	11	22	2	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.4 in	DIP	Beryllium Copper	0.25 µm	10 µin
Aries Electronics 22-4518-10M	3 A	0.125 in	3.18 mm	UL94 V-0	0.1 in	2.54 mm	0.1 "	2.54 mm	Open Frame	Tin	Solder	Through Hole	Gold	200 µin	5.08 µm	11	22	2	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.4 in	DIP	Beryllium Copper	0.25 µm	10 µin
Aries Electronics 22-4518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	0.1 in	2.54 mm	0.1 "	2.54 mm	Open Frame	Tin	Solder	Through Hole	Gold	200 µin	5.08 µm	11	22	2	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.4 in	DIP	Beryllium Copper	0.25 µm	10 µin
Aries Electronics 22-4518-10E	3 A	0.125 in	3.18 mm	UL94 V-0	0.1 in	2.54 mm	0.1 "	2.54 mm	Open Frame	Tin	Solder	Through Hole	Gold	200 µin	5.08 µm	11	22	2	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.4 in	DIP	Beryllium Copper	0.25 µm	10 µin