40-3551 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Housing Material	Type	Type	Type	Pitch - Post	Pitch - Post	Features	Mounting Type	Contact Material - Post	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Material - Mating	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 40-3551-16	UL94 V-0	1 A	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	Closed Frame	Through Hole	Beryllium Copper	40	1.27 µm	50 µin	Nickel Boron	50 µin	1.27 µm	Solder	Beryllium Copper	Nickel Boron	0.1 "	2.54 mm
Aries Electronics 40-3551-11	UL94 V-0	1 A	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	Closed Frame	Through Hole	Beryllium Copper	40			Gold			Solder	Beryllium Copper	Gold	0.1 "	2.54 mm
Aries Electronics 40-3551-10	UL94 V-0	1 A	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	Closed Frame	Through Hole	Beryllium Copper	40	5.08 µm	200 µin	Tin	200 µin	5.08 µm	Solder	Beryllium Copper		0.1 "	2.54 mm
Aries Electronics 40-3551-18	UL94 V-0	1 A	0.11 in	2.78 mm	Polyetheretherketone (PEEK) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	Closed Frame	Through Hole	Beryllium Nickel	40	1.27 µm	50 µin	Nickel Boron	50 µin	1.27 µm	Solder	Beryllium Nickel	Nickel Boron	0.1 "	2.54 mm	-55 C	250 °C