20-1518 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Features | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Housing Material | Type | Type | Termination | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Material - Post [custom] | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | Open Frame | 20 | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | DIP | 5.08 mm | Solder | Gold | 0.25 µm | 10 µin | Tin | Brass | Beryllium Copper | 200 µin | 5.08 µm | Through Hole |
Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | Open Frame | 20 | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | DIP | 5.08 mm | Solder | Gold | 0.25 µm | 10 µin | Gold | Brass | Beryllium Copper | 10 Áin | 0.25 çm | Through Hole |
Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | Open Frame | 20 | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | DIP | 5.08 mm | Solder | Gold | 0.25 µm | 10 µin | Gold | Brass | Beryllium Copper | 10 Áin | 0.25 çm | Through Hole |
Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | Open Frame | 20 | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | DIP | 5.08 mm | Solder | Gold | 0.25 µm | 10 µin | Tin | Brass | Beryllium Copper | 200 µin | 5.08 µm | Through Hole |