26-1518 Series

Catalog

CONN IC DIP SOCKET 26POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Features	Contact Finish - Mating	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Contact Material - Mating	Mounting Type	Housing Material	Type	Type
Aries Electronics 26-1518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	Open Frame	Gold	Tin	0.1 "	2.54 mm	200 µin	5.08 µm	Brass	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	DIP	5.08 mm
Aries Electronics 26-1518-11	UL94 V-0	0.125 in	3.18 mm	3 A	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	Open Frame	Gold	Gold	0.1 "	2.54 mm	10 Áin	0.25 çm	Brass	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	DIP	5.08 mm
Aries Electronics 26-1518-10T	UL94 V-0	0.125 in	3.18 mm	3 A	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	Open Frame	Gold	Tin	0.1 "	2.54 mm	200 µin	5.08 µm	Brass	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	DIP	5.08 mm
Aries Electronics 26-1518-11H	UL94 V-0	0.125 in	3.18 mm	3 A	0.1 in	2.54 mm	0.25 µm	10 µin	Solder	Open Frame	Gold	Gold	0.1 "	2.54 mm	10 Áin	0.25 çm	Brass	Beryllium Copper	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	DIP	5.08 mm