48-3570 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Housing Material | Termination | Contact Material - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Mounting Type | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 in | 2.54 mm | 2 | 48 | 24 | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Beryllium Copper | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | Beryllium Copper | Gold | Through Hole | Closed Frame | 10 Áin | 0.25 çm | Gold |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 in | 2.54 mm | 2 | 48 | 24 | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Beryllium Copper | 0.1 " | 2.54 mm | 5.08 µm | 200 µin | Beryllium Copper | Tin | Through Hole | Closed Frame | 200 µin | 5.08 µm | |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 in | 2.54 mm | 2 | 48 | 24 | Polyphenylene Sulfide (PPS) Glass Filled | Solder | Beryllium Nickel | 0.1 " | 2.54 mm | 1.27 µm | 50 µin | Beryllium Nickel | Nickel Boron | Through Hole | Closed Frame | 50 µin | 1.27 µm | Nickel Boron |