24-3551 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Housing Material | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Type | Type | Type | Contact Material - Mating | Contact Material - Post | Features | Pitch - Post | Pitch - Post | Mounting Type | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | 1.27 µm | 50 µin | 0.1 " | 2.54 mm | Nickel Boron | 50 µin | 1.27 µm | -55 C | 250 °C | Nickel Boron | Polyetheretherketone (PEEK) Glass Filled | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Nickel | Beryllium Nickel | Closed Frame | 0.1 in | 2.54 mm | Through Hole | Solder |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | 5.08 µm | 200 µin | 0.1 " | 2.54 mm | Tin | 200 µin | 5.08 µm | Polyphenylene Sulfide (PPS) Glass Filled | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Copper | Beryllium Copper | Closed Frame | 0.1 in | 2.54 mm | Through Hole | Solder |