40-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Pitch - Post	Pitch - Post	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Features	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Termination	Contact Finish - Post	Mounting Type
Aries Electronics 40-6575-16	0.11 in	2.78 mm	UL94 V-0	1 A	Beryllium Copper	5.08 µm	200 µin	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	40	0.1 "	2.54 mm	Solder	Tin	Through Hole
Aries Electronics 40-6575-18	0.11 in	2.78 mm	UL94 V-0	1 A	Beryllium Copper	5.08 µm	200 µin	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	40	0.1 "	2.54 mm	Solder	Tin	Through Hole