48-3571 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS TIN

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Mounting Type	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Pitch - Mating	Pitch - Mating	Termination	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Post	Housing Material	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Features	Contact Finish - Mating
Aries Electronics 48-3571-10	0.11 in	2.78 mm	UL94 V-0	1 A	Through Hole	Tin	200 µin	5.08 µm	Beryllium Copper	0.1 "	2.54 mm	Solder	2	48	24	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	5.08 µm	200 µin	0.1 in	2.54 mm	Closed Frame
Aries Electronics 48-3571-16	0.11 in	2.78 mm	UL94 V-0	1 A	Through Hole	Nickel Boron	50 µin	1.27 µm	Beryllium Nickel	0.1 "	2.54 mm	Solder	2	48	24	Beryllium Nickel	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	1.27 µm	50 µin	0.1 in	2.54 mm	Closed Frame	Nickel Boron
Aries Electronics 48-3571-11	0.11 in	2.78 mm	UL94 V-0	1 A	Through Hole	Gold	10 Áin	0.25 çm	Beryllium Copper	0.1 "	2.54 mm	Solder	2	48	24	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.25 µm	10 µin	0.1 in	2.54 mm	Closed Frame	Gold