38-3513 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 38POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Housing Material | Mounting Type | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Type | Type | Type | Number of Positions or Pins (Grid) | Operating Temperature [Min] | Operating Temperature [Max] | Features | Contact Finish - Post | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Beryllium Copper | 0.25 µm | 10 µin | Solder | 7.62 mm | 0.3 in | DIP | 38 | -55 C | 105 ░C | Closed Frame | Tin | Brass | 200 µin | 5.08 µm | Gold | 0.1 " | 2.54 mm |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Beryllium Copper | 0.25 µm | 10 µin | Solder | 7.62 mm | 0.3 in | DIP | 38 | -55 C | 105 ░C | Closed Frame | Tin | Brass | 200 µin | 5.08 µm | Gold | 0.1 " | 2.54 mm |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Beryllium Copper | 0.25 µm | 10 µin | Solder | 7.62 mm | 0.3 in | DIP | 38 | -55 C | 105 ░C | Closed Frame | Gold | Brass | 10 Áin | 0.25 çm | Gold | 0.1 " | 2.54 mm |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 3.18 mm | 0.1 in | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Beryllium Copper | 0.25 µm | 10 µin | Solder | 7.62 mm | 0.3 in | DIP | 38 | -55 C | 105 ░C | Closed Frame | Tin | Brass | 200 µin | 5.08 µm | Gold | 0.1 " | 2.54 mm |