40-526 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 40POS TIN
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Pitch - Mating | Pitch - Mating | Housing Material | Termination | Features | Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.105 in | 2.67 mm | UL94 V-0 | 3 A | 10 Áin | 0.25 çm | Through Hole | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | Closed Frame | DIP ZIF (ZIP) | -55 C | 105 ░C | Tin | 40 | 0.1 in | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | Beryllium Copper | |
Aries Electronics | 0.105 in | 2.67 mm | UL94 V-0 | 3 A | 10 Áin | 0.25 çm | Through Hole | 0.1 " | 2.54 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | Solder | Closed Frame | DIP ZIF (ZIP) | -55 C | 125 °C | Gold | 40 | 0.1 in | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | Beryllium Copper | Gold |