40-3572 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 40POS
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Type | Type | Type | Pitch - Post | Pitch - Post | Housing Material | Contact Material - Post | Contact Finish - Post | Termination | Features | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Number of Positions or Pins (Grid) | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Nickel | Nickel Boron | Solder | Closed Frame | Through Hole | 1.27 µm | 50 µin | 0.1 " | 2.54 mm | Nickel Boron | 40 | Beryllium Nickel | 50 µin | 1.27 µm |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 in | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Gold | Solder | Closed Frame | Through Hole | 0.25 çm | 10 Áin | 0.1 " | 2.54 mm | Gold | 40 | Beryllium Copper | 10 µin | 0.25 µm |