25-0518 Series

Catalog

CONN SOCKET SIP 25POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Features	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish - Mating	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Housing Material	Mounting Type
Aries Electronics 25-0518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	0.1 in	2.54 mm	Tin	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Brass	Beryllium Copper	Gold	SIP	200 µin	5.08 µm	1	25	25	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole
Aries Electronics 25-0518-10T	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	0.1 in	2.54 mm	Tin	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Brass	Beryllium Copper	Gold	SIP	200 µin	5.08 µm	1	25	25	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole
Aries Electronics 25-0518-11H	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	0.1 in	2.54 mm	Gold	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Brass	Beryllium Copper	Gold	SIP	10 Áin	0.25 çm	1	25	25	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole
Aries Electronics 25-0518-00	UL94 V-0	0.046 in	1.17 mm	3 A	Open Frame	0.1 in	2.54 mm	Tin	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Brass	Beryllium Copper	Gold	SIP	200 µin	5.08 µm	1	25	25	Polyamide (PA46) Nylon 4/6 Glass Filled	Surface Mount
Aries Electronics 25-0518-10	UL94 V-0	0.125 in	3.18 mm	3 A	Open Frame	0.1 in	2.54 mm	Tin	0.25 µm	10 µin	Solder	0.1 "	2.54 mm	Brass	Beryllium Copper	Gold	SIP	200 µin	5.08 µm	1	25	25	Polyamide (PA46) Nylon 4/6 Glass Filled	Through Hole