32-1518 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Type	Type	Pitch - Mating	Pitch - Mating	Termination	Mounting Type	Contact Finish - Post	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Features
Aries Electronics 32-1518-10	UL94 V-0	0.125 in	3.18 mm	3 A	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Beryllium Copper	DIP	5.08 mm	0.1 "	2.54 mm	Solder	Through Hole	Tin	0.1 in	2.54 mm	32	Brass	Open Frame
Aries Electronics 32-1518-10H	UL94 V-0	0.125 in	3.18 mm	3 A	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	200 µin	5.08 µm	Beryllium Copper	DIP	5.08 mm	0.1 "	2.54 mm	Solder	Through Hole	Tin	0.1 in	2.54 mm	32	Brass	Open Frame
Aries Electronics 32-1518-11	UL94 V-0	0.125 in	3.18 mm	3 A	0.25 µm	10 µin	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	10 Áin	0.25 çm	Beryllium Copper	DIP	5.08 mm	0.1 "	2.54 mm	Solder	Through Hole	Gold	0.1 in	2.54 mm	32	Brass	Open Frame