36-3552 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS TIN
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Termination | Type | Type | Type | Pitch - Mating | Pitch - Mating | Mounting Type | Contact Finish - Post | Housing Material | Contact Material - Post | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | 200 µin | 5.08 µm | 36 | 5.08 µm | 200 µin | Closed Frame | Solder | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Through Hole | Tin | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | Beryllium Copper | |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | 36 | Closed Frame | Solder | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Through Hole | Gold | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | Beryllium Copper | Gold | ||||
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | 50 µin | 1.27 µm | 36 | 1.27 µm | 50 µin | Closed Frame | Solder | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 0.1 " | 2.54 mm | Through Hole | Nickel Boron | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | 0.1 in | 2.54 mm | Beryllium Copper | Nickel Boron |