24-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS GLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Type	Type	Type	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Housing Material	Termination	Contact Material - Post
Aries Electronics 24-3570-11	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	10 Áin	0.25 çm	Through Hole	0.1 in	2.54 mm	12	2	24	0.1 "	2.54 mm	Closed Frame	0.25 µm	10 µin	Gold	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper
Aries Electronics 24-3570-16	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Nickel	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	50 µin	1.27 µm	Through Hole	0.1 in	2.54 mm	12	2	24	0.1 "	2.54 mm	Closed Frame	1.27 µm	50 µin	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Nickel
Aries Electronics 24-3570-10	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	DIP ZIF (ZIP)	7.62 mm	0.3 in		200 µin	5.08 µm	Through Hole	0.1 in	2.54 mm	12	2	24	0.1 "	2.54 mm	Closed Frame	5.08 µm	200 µin	Tin	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper