32-3570 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 32POS GLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Termination | Pitch - Mating | Pitch - Mating | Mounting Type | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Housing Material | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Gold | 10 Áin | 0.25 çm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | 0.1 " | 2.54 mm | Through Hole | Closed Frame | 0.25 µm | 10 µin | Beryllium Copper | 32 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | Beryllium Copper | Gold |
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Tin | 200 µin | 5.08 µm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Solder | 0.1 " | 2.54 mm | Through Hole | Closed Frame | 5.08 µm | 200 µin | Beryllium Copper | 32 | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | Beryllium Copper |