19-0503 Series
Manufacturer: Aries Electronics
CONN SOCKET SIP 19POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Type | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Housing Material | Contact Finish - Mating | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 HB | 0.5 in | 12.7 mm | SIP | 19 | Beryllium Copper | 0.1 " | 2.54 mm | 0.76 Ám | 30 Áin | Gold | Glass Filled Nylon Polyamide (PA) | Gold | Brass | 0.1 in | 2.54 mm | Through Hole | 10 Áin | 0.25 çm | Wire Wrap |
Aries Electronics | 3 A | UL94 HB | 0.36 in | 9.14 mm | SIP | 19 | Beryllium Copper | 0.1 " | 2.54 mm | 0.76 Ám | 30 Áin | Gold | Glass Filled Nylon Polyamide (PA) | Gold | Brass | 0.1 in | 2.54 mm | Through Hole | 10 Áin | 0.25 çm | Wire Wrap |
Aries Electronics | 3 A | UL94 HB | 0.5 in | 12.7 mm | SIP | 19 | Beryllium Copper | 0.1 " | 2.54 mm | 0.76 Ám | 30 Áin | Tin | Glass Filled Nylon Polyamide (PA) | Gold | Brass | 0.1 in | 2.54 mm | Through Hole | 200 µin | 5.08 µm | Wire Wrap |
Aries Electronics | 3 A | UL94 HB | 0.36 in | 9.14 mm | SIP | 19 | Beryllium Copper | 0.1 " | 2.54 mm | 0.76 Ám | 30 Áin | Tin | Glass Filled Nylon Polyamide (PA) | Gold | Brass | 0.1 in | 2.54 mm | Through Hole | 200 µin | 5.08 µm | Wire Wrap |