133-PGM Series
Manufacturer: Aries Electronics
CONN SOCKET PGA GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish - Mating | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Type | Contact Material - Post [custom] | Housing Material | Mounting Type | Termination | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | 4.19 mm | 0.165 " | UL94 V-0 | Gold | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Beryllium Copper | PGA | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Solder | 0.1 in | 2.54 mm | -55 C | 105 ░C |
Aries Electronics | 3 A | 4.19 mm | 0.165 " | UL94 V-0 | Gold | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Beryllium Copper | PGA | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Solder | 0.1 in | 2.54 mm | -55 C | 105 ░C |
Aries Electronics | 3 A | 4.19 mm | 0.165 " | UL94 V-0 | Gold | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Beryllium Copper | PGA | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Solder | 0.1 in | 2.54 mm | -55 C | 105 ░C |
Aries Electronics | 3 A | 4.19 mm | 0.165 " | UL94 V-0 | Gold | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Beryllium Copper | PGA | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Solder | 0.1 in | 2.54 mm | -55 C | 105 ░C |
Aries Electronics | 3 A | 4.19 mm | 0.165 " | UL94 V-0 | Gold | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | 0.25 µm | 10 µin | Beryllium Copper | PGA | Brass | Polyamide (PA46) Nylon 4/6 Glass Filled | Through Hole | Solder | 0.1 in | 2.54 mm | -55 C | 105 ░C |