32-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Type	Type	Type	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Contact Finish - Mating	Termination	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Material - Post	Contact Material - Mating	Features	Mounting Type	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 32-3552-11	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	32	Gold	Solder	0.1 "	2.54 mm	Gold	Beryllium Copper	Beryllium Copper	Closed Frame	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 32-3552-10	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	32		Solder	0.1 "	2.54 mm	Tin	Beryllium Copper	Beryllium Copper	Closed Frame	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	5.08 µm	200 µin	200 µin	5.08 µm
Aries Electronics 32-3552-18	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	32	Nickel Boron	Solder	0.1 "	2.54 mm	Nickel Boron	Beryllium Nickel	Beryllium Nickel	Closed Frame	Through Hole	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	50 µin	1.27 µm	-55 C	250 °C