22-8125 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 22POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Post | Pitch - Post | Contact Finish - Post | Features | Pitch - Mating | Pitch - Mating | Termination | Type [custom] | Type [custom] | Type | Operating Temperature [Min] | Operating Temperature [Max] | Housing Material | Contact Finish - Mating | Mounting Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | UL94 V-0 | 3.56 mm | 0.14 in | 10 Áin | 0.25 çm | 11 | 22 | 2 | Beryllium Copper | Brass | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Gold | Closed Frame Elevated | 0.1 " | 2.54 mm | Solder | 15.24 mm | 0.6 in | DIP | -55 C | 105 ░C | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Through Hole | ||
Aries Electronics | 3 A | UL94 V-0 | 3.56 mm | 0.14 in | 10 Áin | 0.25 çm | 11 | 22 | 2 | Beryllium Copper | Brass | 0.76 Ám | 30 Áin | 0.1 in | 2.54 mm | Gold | Closed Frame Elevated | 0.1 " | 2.54 mm | Solder | DIP | -55 C | 105 ░C | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Through Hole | 7.62 mm | 0.3 in |