48-3553 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Features | Contact Material - Mating | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Closed Frame | Beryllium Copper | Through Hole | 5.08 µm | 200 µin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 2 | 48 | 24 | Solder | 200 µin | 5.08 µm | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Tin | |||
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Closed Frame | Beryllium Nickel | Through Hole | 1.27 µm | 50 µin | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | 2 | 48 | 24 | Solder | 50 µin | 1.27 µm | Beryllium Nickel | Polyetheretherketone (PEEK) Glass Filled | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | Nickel Boron | -55 C | 250 °C | Nickel Boron |