34-3513 Series

Catalog

CONN IC DIP SOCKET 34POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Type	Type	Type	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Features	Contact Material - Post [custom]	Contact Material - Mating	Termination	Housing Material	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]
Aries Electronics 34-3513-10H	0.125 in	3.18 mm	UL94 V-0	3 A	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	0.25 µm	10 µin	Gold	200 µin	5.08 µm	Tin	-55 C	105 ░C	Through Hole	Closed Frame	Brass	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	34	2	17
Aries Electronics 34-3513-11H	0.125 in	3.18 mm	UL94 V-0	3 A	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	0.25 µm	10 µin	Gold	10 Áin	0.25 çm	Gold	-55 C	105 ░C	Through Hole	Closed Frame	Brass	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	34	2	17
Aries Electronics 34-3513-11	0.125 in	3.18 mm	UL94 V-0	3 A	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	0.25 µm	10 µin	Gold	10 Áin	0.25 çm	Gold	-55 C	105 ░C	Through Hole	Closed Frame	Brass	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	34	2	17
Aries Electronics 34-3513-10T	0.125 in	3.18 mm	UL94 V-0	3 A	7.62 mm	0.3 in	DIP	0.1 "	2.54 mm	0.25 µm	10 µin	Gold	200 µin	5.08 µm	Tin	-55 C	105 ░C	Through Hole	Closed Frame	Brass	Beryllium Copper	Solder	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	34	2	17