28-3574 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS GLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Finish - Mating	Termination	Housing Material	Contact Material - Post	Contact Finish - Post	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Material - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)
Aries Electronics 28-3574-11	0.11 in	2.78 mm	1 A	UL94 V-0	Gold	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.25 µm	10 µin	0.1 in	2.54 mm	Beryllium Copper	Through Hole	10 Áin	0.25 çm	Closed Frame	0.1 "	2.54 mm	28
Aries Electronics 28-3574-16	0.11 in	2.78 mm	1 A	UL94 V-0	Gold	Solder	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	Gold	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.25 µm	10 µin	0.1 in	2.54 mm	Beryllium Copper	Through Hole	10 Áin	0.25 çm	Closed Frame	0.1 "	2.54 mm	28