24-0513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 24POS GOLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Mounting Type | Number of Positions or Pins (Grid) | Termination | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Housing Material | Contact Finish - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | 200 µin | 5.08 µm | Brass | Through Hole | 24 | Solder | Beryllium Copper | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Tin | 0.1 in | 2.54 mm |
Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | 10 Áin | 0.25 çm | Brass | Through Hole | 24 | Solder | Beryllium Copper | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Gold | 0.1 in | 2.54 mm |
Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | 200 µin | 5.08 µm | Brass | Through Hole | 24 | Solder | Beryllium Copper | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Tin | 0.1 in | 2.54 mm |
Aries Electronics | 0.125 in | 3.18 mm | 3 A | UL94 V-0 | 10 Áin | 0.25 çm | Brass | Through Hole | 24 | Solder | Beryllium Copper | 0.1 " | 2.54 mm | 0.25 µm | 10 µin | SIP | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Gold | 0.1 in | 2.54 mm |