209-PGM Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET PGA GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Mating | Contact Finish - Mating | Contact Material - Post [custom] | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Pitch - Post | Pitch - Post | Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 4.19 mm | 0.165 " | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 C | 105 ░C | 0.1 in | 2.54 mm | PGA | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Polyamide (PA46) Nylon 4/6 Glass Filled |
 Aries Electronics | UL94 V-0 | 3 A | 4.19 mm | 0.165 " | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 C | 105 ░C | 0.1 in | 2.54 mm | PGA | Tin | 0.1 " | 2.54 mm | 200 µin | 5.08 µm | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 3 A | 4.19 mm | 0.165 " | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 C | 125 °C | 0.1 in | 2.54 mm | PGA | Gold | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 3 A | 4.19 mm | 0.165 " | 0.25 µm | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 C | 125 °C | 0.1 in | 2.54 mm | PGA | Gold | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | Polyamide (PA46) Nylon 4/6 Glass Filled |