CSD17313Q2 Series

30-V, N channel NexFET™ power MOSFET, single SON 2 mm x 2 mm, 32 mOhm

Catalog

30-V, N channel NexFET™ power MOSFET, single SON 2 mm x 2 mm, 32 mOhm

Part	Power Dissipation (Max)	Current - Continuous Drain (Id) @ 25°C	Drive Voltage (Max Rds On, Min Rds On) [Max]	Drive Voltage (Max Rds On, Min Rds On) [Min]	FET Type	Mounting Type	Vgs(th) (Max) @ Id	Vgs (Max) [Max]	Vgs (Max) [Min]	Rds On (Max) @ Id, Vgs	Drain to Source Voltage (Vdss)	Input Capacitance (Ciss) (Max) @ Vds [Max]	Supplier Device Package	Technology	Gate Charge (Qg) (Max) @ Vgs	Operating Temperature [Min]	Operating Temperature [Max]
Texas Instruments CSD17313Q2Q1	2.3 W	5 A	8 V	3 V	N-Channel	Surface Mount	1.8 V	10 V	-8 V	30 mOhm	30 V	340 pF	6-WSON (2x2)	MOSFET (Metal Oxide)	2.7 nC	-55 °C	150 °C
Texas Instruments CSD17313Q2T	2.4 W 17 W	5 A	8 V	3 V	N-Channel	Surface Mount	1.8 V	10 V	-8 V	30 mOhm	30 V	340 pF	6-WSON (2x2)	MOSFET (Metal Oxide)	2.7 nC	-55 °C	150 °C

Catalog

30-V, N channel NexFET™ power MOSFET, single SON 2 mm x 2 mm, 32 mOhm

Key Features

• Optimized for 5-V Gate DriveUltra-Low Qgand QgdLow Thermal ResistancePb-FreeRoHS CompliantHalogen-FreeSON 2-mm × 2-mm Plastic PackageAPPLICATIONSDC-DC ConvertersBattery and Load Management ApplicationsAll other trademarks are the property of their respective ownersOptimized for 5-V Gate DriveUltra-Low Qgand QgdLow Thermal ResistancePb-FreeRoHS CompliantHalogen-FreeSON 2-mm × 2-mm Plastic PackageAPPLICATIONSDC-DC ConvertersBattery and Load Management ApplicationsAll other trademarks are the property of their respective owners

Description

This 30-V, 24-mΩ, 2-mm × 2-mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion applications and optimized for 5-V gate drive applications. The 2-mm × 2-mm SON offers excellent thermal performance for the size of the package. This 30-V, 24-mΩ, 2-mm × 2-mm SON NexFET™ power MOSFET is designed to minimize losses in power conversion applications and optimized for 5-V gate drive applications. The 2-mm × 2-mm SON offers excellent thermal performance for the size of the package.