36-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS GLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Housing Material	Contact Material - Post	Pitch - Post	Pitch - Post	Termination	Features	Type	Type	Contact Finish - Mating	Contact Material - Mating	Contact Finish - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 36-6553-10	1 A	0.11 in	2.78 mm	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 in	2.54 mm	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Gold	Beryllium Copper	Gold	Through Hole	0.1 "	2.54 mm	36
Aries Electronics 36-6553-18	1 A	0.11 in	2.78 mm	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 in	2.54 mm	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing		Beryllium Copper	Tin	Through Hole	0.1 "	2.54 mm	40	5.08 µm	200 µin	200 µin	5.08 µm
Aries Electronics 36-6553-11	1 A	0.11 in	2.78 mm	UL94 V-0	Polyphenylene Sulfide (PPS) Glass Filled	Beryllium Copper	0.1 in	2.54 mm	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	Beryllium Copper	Nickel Boron	Through Hole	0.1 "	2.54 mm	36	1.27 µm	50 µin	50 µin	1.27 µm
Aries Electronics 36-6553-16	1 A	0.11 in	2.78 mm	UL94 V-0	Polyetheretherketone (PEEK) Glass Filled	Beryllium Nickel	0.1 in	2.54 mm	Solder	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Nickel Boron	Beryllium Nickel	Nickel Boron	Through Hole	0.1 "	2.54 mm	36	1.27 µm	50 µin	50 µin	1.27 µm	-55 C	250 °C