32-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Material - Post	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Finish - Post	Termination	Type	Type	Features	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post
Aries Electronics 32-6571-11	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper	Gold	10 Áin	0.25 çm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 "	2.54 mm	0.25 µm	10 µin	Beryllium Copper	Through Hole	32	0.1 in	2.54 mm
Aries Electronics 32-6571-10	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Copper		200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Tin	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 "	2.54 mm	5.08 µm	200 µin	Beryllium Copper	Through Hole	32	0.1 in	2.54 mm
Aries Electronics 32-6571-16	UL94 V-0	1 A	0.11 in	2.78 mm	Beryllium Nickel	Nickel Boron	50 µin	1.27 µm	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	Solder	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 "	2.54 mm	1.27 µm	50 µin	Beryllium Nickel	Through Hole	32	0.1 in	2.54 mm