36-6551 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS GLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Contact Finish - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Material - Post | Type | Type | Number of Positions or Pins (Grid) | Features | Termination | Contact Material - Mating | Housing Material | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Gold | Gold | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 36 | Closed Frame | Solder | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | ||||
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Tin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 36 | Closed Frame | Solder | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | 200 µin | 5.08 µm | 5.08 µm | 200 µin | |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Nickel Boron | Nickel Boron | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Beryllium Copper | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 36 | Closed Frame | Solder | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | 50 µin | 1.27 µm | 1.27 µm | 50 µin |