20-9503 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish - Mating | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Contact Material - Mating | Termination | Pitch - Post | Pitch - Post | Contact Finish - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Mounting Type | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 9.14 mm | 0.36 in | Gold | DIP | 22.86 mm | 0.9 in | 200 µin | 5.08 µm | Phosphor Bronze | Beryllium Copper | Wire Wrap | 0.1 in | 2.54 mm | Tin | Closed Frame | 0.25 µm | 10 µin | 20 | Through Hole | 0.1 " | 2.54 mm | -55 C | 105 ░C | Polyamide (PA46) Nylon 4/6 Glass Filled |
Aries Electronics | UL94 V-0 | 3 A | 9.14 mm | 0.36 in | Gold | DIP | 22.86 mm | 0.9 in | 10 Áin | 0.25 çm | Phosphor Bronze | Beryllium Copper | Wire Wrap | 0.1 in | 2.54 mm | Gold | Closed Frame | 0.25 µm | 10 µin | 20 | Through Hole | 0.1 " | 2.54 mm | -55 C | 125 °C | Polyamide (PA46) Nylon 4/6 Glass Filled |