08-3513 Series

Catalog

CONN IC DIP SOCKET 8POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Termination	Contact Finish - Post	Features	Mounting Type	Housing Material	Type	Type	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post [custom]	Contact Material - Mating
Aries Electronics 08-3513-10H	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	Tin	Closed Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	7.62 mm	0.3 in	DIP	200 µin	5.08 µm	0.1 "	2.54 mm	0.1 in	2.54 mm	-55 C	105 ░C	8	2	4	Gold	0.25 µm	10 µin	Brass	Beryllium Copper
Aries Electronics 08-3513-00	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	Tin	Closed Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	7.62 mm	0.3 in	DIP	200 µin	5.08 µm	0.1 "	2.54 mm	0.1 in	2.54 mm	-55 C	105 ░C	8	2	4	Gold	0.25 µm	10 µin	Brass	Beryllium Copper
Aries Electronics 08-3513-10	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	Tin	Closed Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	7.62 mm	0.3 in	DIP	200 µin	5.08 µm	0.1 "	2.54 mm	0.1 in	2.54 mm	-55 C	105 ░C	8	2	4	Gold	0.25 µm	10 µin	Brass	Beryllium Copper
Aries Electronics 08-3513-10T	UL94 V-0	3 A	0.125 in	3.18 mm	Solder	Tin	Closed Frame	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	7.62 mm	0.3 in	DIP	200 µin	5.08 µm	0.1 "	2.54 mm	0.1 in	2.54 mm	-55 C	105 ░C	8	2	4	Gold	0.25 µm	10 µin	Brass	Beryllium Copper