44-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Contact Material - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Finish - Post	Type	Type	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Housing Material	Mounting Type	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 44-6574-10	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	2 22	44	Tin	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	Closed Frame	5.08 µm	200 µin
Aries Electronics 44-6574-18	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	2 22	44	Tin	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	Closed Frame	5.08 µm	200 µin
Aries Electronics 44-6574-16	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	2 22	44	Tin	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	Closed Frame	5.08 µm	200 µin
Aries Electronics 44-6574-11	0.11 in	2.78 mm	UL94 V-0	1 A	0.1 in	2.54 mm	Beryllium Copper	2 22	44	Tin	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	Closed Frame	5.08 µm	200 µin