20-8100 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Termination | Number of Positions or Pins (Grid) | Features | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Contact Material - Mating | Housing Material | Type [custom] | Type [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 3.56 mm | 0.14 in | Gold | 0.1 " | 2.54 mm | Solder | 20 | Closed Frame Elevated | Gold | 0.76 Ám | 30 Áin | 7.62 mm | 0.3 in | DIP | Brass | 0.1 in | 2.54 mm | -55 C | 105 ░C | 10 Áin | 0.25 çm | Through Hole | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | ||
Aries Electronics | UL94 V-0 | 3 A | 3.56 mm | 0.14 in | Gold | 0.1 " | 2.54 mm | Solder | 20 | Closed Frame Elevated | Gold | 0.76 Ám | 30 Áin | DIP | Brass | 0.1 in | 2.54 mm | -55 C | 105 ░C | 10 Áin | 0.25 çm | Through Hole | Beryllium Copper | Polyamide (PA46) Nylon 4/6 Glass Filled | 15.24 mm | 0.6 in |