50-9513 Series

Catalog

CONN IC DIP SOCKET 50POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Contact Material - Post [custom]	Features	Housing Material	Pitch - Post	Pitch - Post	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Mounting Type	Type	Type	Type
Aries Electronics 50-9513-11H	3 A	UL94 V-0	0.125 in	3.18 mm	0.25 µm	10 µin	Gold	2	50	25	Brass	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Solder	-55 C	105 ░C	10 Áin	0.25 çm	Beryllium Copper	Through Hole	DIP	22.86 mm	0.9 in
Aries Electronics 50-9513-11	3 A	UL94 V-0	0.125 in	3.18 mm	0.25 µm	10 µin	Gold	2	50	25	Brass	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Solder	-55 C	105 ░C	10 Áin	0.25 çm	Beryllium Copper	Through Hole	DIP	22.86 mm	0.9 in
Aries Electronics 50-9513-10T	3 A	UL94 V-0	0.125 in	3.18 mm	0.25 µm	10 µin	Tin	2	50	25	Brass	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Solder	-55 C	105 ░C	200 µin	5.08 µm	Beryllium Copper	Through Hole	DIP	22.86 mm	0.9 in
Aries Electronics 50-9513-10H	3 A	UL94 V-0	0.125 in	3.18 mm	0.25 µm	10 µin	Tin	2	50	25	Brass	Closed Frame	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Gold	0.1 "	2.54 mm	Solder	-55 C	105 ░C	200 µin	5.08 µm	Beryllium Copper	Through Hole	DIP	22.86 mm	0.9 in