16-0518 Series

Catalog

CONN SOCKET SIP 16POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Mounting Type	Contact Material - Post [custom]	Housing Material	Pitch - Post	Pitch - Post	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Contact Finish - Mating	Contact Finish - Post	Type
Aries Electronics 16-0518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	16	1 x 16	Through Hole	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Open Frame	200 µin	5.08 µm	Beryllium Copper	Gold	Tin	SIP
Aries Electronics 16-0518-11	0.125 in	3.18 mm	UL94 V-0	3 A	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	16	1 x 16	Through Hole	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Open Frame	10 Áin	0.25 çm	Beryllium Copper	Gold	Gold	SIP
Aries Electronics 16-0518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	16	1 x 16	Through Hole	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Open Frame	10 Áin	0.25 çm	Beryllium Copper	Gold	Gold	SIP
Aries Electronics 16-0518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	16	1 x 16	Through Hole	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Open Frame	200 µin	5.08 µm	Beryllium Copper	Gold	Tin	SIP
Aries Electronics 16-0518-00	0.046 in	1.17 mm	UL94 V-0	3 A	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	16	1 x 16	Surface Mount	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Open Frame	200 µin	5.08 µm	Beryllium Copper	Gold	Tin	SIP
Aries Electronics 16-0518-10H	0.125 in	3.18 mm	UL94 V-0	3 A	Solder	0.25 µm	10 µin	0.1 "	2.54 mm	16	1 x 16	Through Hole	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Open Frame	200 µin	5.08 µm	Beryllium Copper	Gold	Tin	SIP