24LC00 Series
Manufacturer: Microchip Technology
Beta
⌘K
EEPROM, 128 BIT, 16 X 8BIT, I2C, 400 KHZ, TDFN-EP, 8 PINS
| Part | Memory Type | Technology | Memory Organization [custom] | Memory Organization [custom] | Memory Interface | Memory Format | Mounting Type | Supplier Device Package | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Write Cycle Time - Word, Page | Voltage - Supply [Min] | Voltage - Supply [Max] | Clock Frequency | Memory Size | Access Time | Package / Case [custom] | Package / Case [custom] | Package / Case [y] | Package / Case [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | 8-TDFN (2x3) | 85 °C | -40 °C | 8-WFDFN Exposed Pad | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | ||||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | SOT-23-5 | 85 °C | -40 °C | SC-74A SOT-753 | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | ||||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | Die | 70 °C | 0 °C | Die | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | ||||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | 8-TSSOP | 70 °C | 0 °C | 8-TSSOP | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | 0.173 " | 4.4 mm | ||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | SOT-23-5 | 85 °C | -40 °C | SC-74A SOT-753 | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | ||||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | 8-SOIC | 85 °C | -40 °C | 8-SOIC | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | 3.9 mm | 0.154 in | ||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | 8-SOIC | 70 °C | 0 °C | 8-SOIC | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | 3.9 mm | 0.154 in | ||
Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | Die | 70 °C | 0 °C | Die | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | ||||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | 8-SOIC | 85 °C | -40 °C | 8-SOIC | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | 3.9 mm | 0.154 in | ||
 Microchip Technology | Non-Volatile | EEPROM | 8 | 16 | I2C | EEPROM | Surface Mount | 8-SOIC | 70 °C | 0 °C | 8-SOIC | 4 ms | 2.5 V | 5.5 V | 400 kHz | 16 B | 3.5 µs | 3.9 mm | 0.154 in |