16-1508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Mounting Type | Type | Type | Termination | Housing Material | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Contact Finish - Post | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 9.14 mm | 0.36 in | UL94 V-0 | 3 A | Through Hole | DIP | 5.08 mm | Wire Wrap | Polyamide (PA46) Nylon 4/6 | 0.1 in | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 2 | 16 | 8 | Gold | Gold | -55 C | 125 °C | Brass | 10 Áin | 0.25 çm | Closed Frame |
Aries Electronics | 9.14 mm | 0.36 in | UL94 V-0 | 3 A | Through Hole | DIP | 5.08 mm | Wire Wrap | Polyamide (PA46) Nylon 4/6 | 0.1 in | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 2 | 16 | 8 | Tin | Gold | -55 C | 105 ░C | Brass | 200 µin | 5.08 µm | Closed Frame |
Aries Electronics | 12.7 mm | 0.5 in | UL94 V-0 | 3 A | Through Hole | DIP | 5.08 mm | Wire Wrap | Polyamide (PA46) Nylon 4/6 | 0.1 in | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 2 | 16 | 8 | Tin | Gold | -55 C | 105 ░C | Brass | 200 µin | 5.08 µm | Closed Frame |
Aries Electronics | 12.7 mm | 0.5 in | UL94 V-0 | 3 A | Through Hole | DIP | 5.08 mm | Wire Wrap | Polyamide (PA46) Nylon 4/6 | 0.1 in | 2.54 mm | Beryllium Copper | 0.25 µm | 10 µin | 0.1 " | 2.54 mm | 2 | 16 | 8 | Gold | Gold | -55 C | 125 °C | Brass | 10 Áin | 0.25 çm | Closed Frame |