42-3551 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 42POS GLD
| Part | Termination Post Length | Termination Post Length | Current Rating (Amps) | Material Flammability Rating | Termination | Pitch - Mating | Pitch - Mating | Housing Material | Pitch - Post | Pitch - Post | Type | Type | Type | Features | Contact Finish - Mating | Contact Material - Post | Number of Positions or Pins (Grid) | Contact Material - Mating | Mounting Type | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Solder | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Gold | Beryllium Copper | 42 | Beryllium Copper | Through Hole | Gold | ||||||
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Solder | 0.1 " | 2.54 mm | Polyetheretherketone (PEEK) Glass Filled | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Nickel Boron | Beryllium Nickel | 42 | Beryllium Nickel | Through Hole | Nickel Boron | -55 C | 250 °C | 1.27 µm | 50 µin | 50 µin | 1.27 µm |
Aries Electronics | 0.11 in | 2.78 mm | 1 A | UL94 V-0 | Solder | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame | Nickel Boron | Beryllium Copper | 42 | Beryllium Copper | Through Hole | Nickel Boron | 1.27 µm | 50 µin | 50 µin | 1.27 µm |