48-3572 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Contact Finish - Post	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Material - Mating	Mounting Type	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination
Aries Electronics 48-3572-16	1 A	UL94 V-0	0.11 in	2.78 mm	0.1 "	2.54 mm	Nickel Boron	Beryllium Nickel	Closed Frame	50 µin	1.27 µm	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	2	48	24	Beryllium Nickel	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	1.27 µm	50 µin	Solder
Aries Electronics 48-3572-10	1 A	UL94 V-0	0.11 in	2.78 mm	0.1 "	2.54 mm		Beryllium Copper	Closed Frame	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	Tin	2	48	24	Beryllium Copper	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	5.08 µm	200 µin	Solder
Aries Electronics 48-3572-11	1 A	UL94 V-0	0.11 in	2.78 mm	0.1 "	2.54 mm	Gold	Beryllium Copper	Closed Frame	10 µin	0.25 µm	Polyphenylene Sulfide (PPS) Glass Filled	Gold	2	48	24	Beryllium Copper	Through Hole	DIP ZIF (ZIP)	7.62 mm	0.3 in	0.1 in	2.54 mm	0.25 çm	10 Áin	Solder