24-3508 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Finish - Mating	Features	Termination	Pitch - Post	Pitch - Post	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Housing Material	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Type	Type	Type	Contact Material - Mating	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 24-3508-201	3 A	9.14 mm	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	105 ░C	200 µin	5.08 µm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-31	3 A	12.7 mm	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	125 °C	10 Áin	0.25 çm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-211	3 A	12.7 mm	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	125 °C	10 Áin	0.25 çm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-30	3 A	9.14 mm	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	105 ░C	200 µin	5.08 µm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-20	3 A	9.14 mm	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	105 ░C	200 µin	5.08 µm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-212	3 A	12.7 mm	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	125 °C	10 Áin	0.25 çm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-312	3 A	12.7 mm	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	125 °C	10 Áin	0.25 çm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-302	3 A	9.14 mm	0.36 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	105 ░C	200 µin	5.08 µm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Tin	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin
Aries Electronics 24-3508-21	3 A	12.7 mm	0.5 in	UL94 V-0	Gold	Open Frame	Wire Wrap	0.1 in	2.54 mm	-55 C	125 °C	10 Áin	0.25 çm	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	7.62 mm	0.3 in	DIP	Beryllium Copper	12	2	24	Through Hole	0.76 Ám	30 Áin