24-C212 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Type [custom] | Type [custom] | Type | Mounting Type | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Contact Material - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 3.18 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Gold | 12 | 2 | 24 | 0.1 " | 2.54 mm | Solder | 0.25 µm | 10 µin | 10 Áin | 0.25 çm | Closed Frame | 15.24 mm | 0.6 in | DIP | Through Hole | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Gold |
Aries Electronics | 3 A | UL94 V-0 | 0.125 in | 3.18 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 105 ░C | Gold | 12 | 2 | 24 | 0.1 " | 2.54 mm | Solder | 0.25 µm | 10 µin | 200 µin | 5.08 µm | Closed Frame | 15.24 mm | 0.6 in | DIP | Through Hole | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Tin |
Aries Electronics | 3 A | UL94 V-0 | 0.04 in | 1.02 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Gold | 12 | 2 | 24 | 0.1 " | 2.54 mm | Wire Wrap | 0.25 µm | 10 µin | 10 Áin | 0.25 çm | Closed Frame | 15.24 mm | 0.6 in | DIP | Through Hole | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Gold |
Aries Electronics | 3 A | UL94 V-0 | 0.04 in | 1.02 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 105 ░C | Gold | 12 | 2 | 24 | 0.1 " | 2.54 mm | Solder | 0.25 µm | 10 µin | 200 µin | 5.08 µm | Closed Frame | 15.24 mm | 0.6 in | DIP | Surface Mount | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Tin |
Aries Electronics | 3 A | UL94 V-0 | 0.04 in | 1.02 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 105 ░C | Gold | 12 | 2 | 24 | 0.1 " | 2.54 mm | Wire Wrap | 0.25 µm | 10 µin | 200 µin | 5.08 µm | Closed Frame | 15.24 mm | 0.6 in | DIP | Through Hole | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Tin |
Aries Electronics | 3 A | UL94 V-0 | 0.04 in | 1.02 mm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Gold | 12 | 2 | 24 | 0.1 " | 2.54 mm | Wire Wrap | 0.25 µm | 10 µin | 10 Áin | 0.25 çm | Closed Frame | 15.24 mm | 0.6 in | DIP | Through Hole | 0.1 in | 2.54 mm | Brass | Beryllium Copper | Gold |