37-0518 Series

Catalog

CONN SOCKET SIP 37POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Pitch - Post	Pitch - Post	Features	Mounting Type	Termination	Type	Contact Finish - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]
Aries Electronics 37-0518-10H	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Open Frame	Through Hole	Solder	SIP	Gold	Tin	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Brass	37	1	37
Aries Electronics 37-0518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Open Frame	Through Hole	Solder	SIP	Gold	Tin	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Brass	37	1	37
Aries Electronics 37-0518-11H	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Open Frame	Through Hole	Solder	SIP	Gold	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Brass	37	1	37
Aries Electronics 37-0518-11	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Open Frame	Through Hole	Solder	SIP	Gold	Gold	0.25 µm	10 µin	Beryllium Copper	10 Áin	0.25 çm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Brass	37	1	37
Aries Electronics 37-0518-10	0.125 in	3.18 mm	UL94 V-0	3 A	0.1 in	2.54 mm	Open Frame	Through Hole	Solder	SIP	Gold	Tin	0.25 µm	10 µin	Beryllium Copper	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 "	2.54 mm	Brass	37	1	37