40-3552 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 40POS
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Operating Temperature [Min] | Operating Temperature [Max] | Housing Material | Contact Material - Post | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Finish - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Mounting Type | Type | Type | Type | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | -55 C | 250 °C | Polyetheretherketone (PEEK) Glass Filled | Beryllium Nickel | 40 | 50 µin | 1.27 µm | Solder | Nickel Boron | Nickel Boron | 1.27 µm | 50 µin | Beryllium Nickel | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Through Hole | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame |
Aries Electronics | UL94 V-0 | 1 A | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | 40 | 50 µin | 1.27 µm | Solder | Nickel Boron | Nickel Boron | 1.27 µm | 50 µin | Beryllium Copper | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Through Hole | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Closed Frame |