36-3573 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Contact Finish - Mating	Type	Type	Type	Contact Material - Post	Contact Finish - Post	Features	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Contact Material - Mating	Pitch - Post	Pitch - Post
Aries Electronics 36-3573-16	UL94 V-0	0.11 in	2.78 mm	1 A	1.27 µm	50 µin	Polyphenylene Sulfide (PPS) Glass Filled	Nickel Boron	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Nickel	Nickel Boron	Closed Frame	Solder	50 µin	1.27 µm	Through Hole	0.1 "	2.54 mm	36	Beryllium Nickel	0.1 in	2.54 mm
Aries Electronics 36-3573-11	UL94 V-0	0.11 in	2.78 mm	1 A	0.25 çm	10 Áin	Polyphenylene Sulfide (PPS) Glass Filled	Gold	DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	Gold	Closed Frame	Solder	10 µin	0.25 µm	Through Hole	0.1 "	2.54 mm	36	Beryllium Copper	0.1 in	2.54 mm
Aries Electronics 36-3573-10	UL94 V-0	0.11 in	2.78 mm	1 A	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled		DIP ZIF (ZIP)	7.62 mm	0.3 in	Beryllium Copper	Tin	Closed Frame	Solder	200 µin	5.08 µm	Through Hole	0.1 "	2.54 mm	36	Beryllium Copper	0.1 in	2.54 mm